praetorian? l-c lcd and camera emi filter array with esd protection cm1690 ?2010 scillc. all rights reserved. publication order number: may 2010 ? rev. 2 cm1690/d features ? four, six and eight channels of emi filtering wit h integrated esd protection ? pi-style emi filters in a capacitor-inductor- capacitor (c-l-c) network ? 15kv esd protection on each channel (iec 61000-4-2 level 4, contact discharge) ? 30kv esd protection on each channel (hbm) ? greater than -35db attenuation (typical) at 1ghz ? 0.5mm thick udfn package with 0.40mm lead pitch: ? 4-channel = 8-lead udfn ? 6-channel = 12-lead udfn ? 8-channel = 16-lead udfn ? tiny udfn package size: ? 8-lead: 1.70mm x 1.35mm ? 12-lead: 2 . 50mm x 1.35mm ? 16-lead: 3.30mm x 1.35mm ? lead-free packaging applications ? lcd and camera data lines in mobile handsets ? wireless handsets ? lcd and camera modules product description the cm1690 is a family of pi-style emi filter array s with esd protection, which integrates four, six and eight filters (c-l-c) in small form factor udfn 0.40mm pitch packages. each emi filter channel of the cm1690 is implemented as a 3-pole l-c filter where the component values are 16pf-12nh-16pf. the cm1690's roll-off frequency at ?6db attenuation is 330mhz and can be used in applications where the data rates are as high as 140mbps while providing greater than -35db attenuation over the 1.0ghz to 3.0ghz frequency range. the parts include esd diodes on every pin, which provide a very high leve l of protection for sensitive electronic components t hat may be subjected to electrostatic discharge (esd). the esd protection diodes connected to the filter ports are designed and characterized to safely dissipate esd strikes of 15kv, beyond the maximum requirement of the iec61000-4-2 international standard. using the mil-std-883 (method 3015) specification for human body model (hbm) esd, the pins are protected for contact discharges at greater than 30kv. this device is particularly well suited for wireles s handsets, mobile lcd modules and pdas because of its small package format and easy-to-use pin assignments. in particular, the cm1690 is ideal for emi filtering and protecting data and control lines for the lcd display and camera interface in mobile handsets. the cm1690 is available in space saving, ultra low profile 8-, 12-, and 16-lead 0.40mm udfn packages with lead-free finishing.
cm1690 rev. 2 | page 2 of 10 | www.onsemi.com electrical schematic 1 of 4, 6 or 8 emi/rfi filter channels with integrated esd protection
cm1690 rev. 2 | page 3 of 10 | www.onsemi.com pin descriptions device pin(s) device pin(s) -04 -06 -08 name description -04 -06 -08 name description 1 1 1 filter1 filter + esd channel 1 8 12 16 filter1 filter + esd channel 1 2 2 2 filter2 filter + esd channel 2 7 11 15 filter2 filter + esd channel 2 3 3 3 filter3 filter + esd channel 3 6 10 14 filter3 filter + esd channel 3 4 4 4 filter4 filter + esd channel 4 5 9 13 filter4 filter + esd channel 4 5 5 filter5 filter + esd channel 5 8 12 filter5 filter + esd channel 5 6 6 filter6 filter + esd channel 6 7 11 filter6 filter + esd channel 6 7 filter7 filter + esd channel 7 10 filter7 filter + esd channel 7 8 filter8 filter + esd channel 8 9 filter8 filter + esd channel 8 gnd pad gnd device ground ordering information part numbering information lead-free finish pins package ordering part number 1 part marking 8 udfn-8 CM1690-04DE p9 12 udfn-12 cm1690-06de p906 16 udfn-16 cm1690-08de p908e note 1: parts are shipped in tape & reel form unles s otherwise specified.
cm1690 rev. 2 | page 4 of 10 | www.onsemi.com specifications absolute maximum ratings parameter rating units storage temperature range ?65 to +150 c current per inductor 30 ma dc package power rating 500 mw standard operating conditions parameter rating units operating temperature range ?40 to +85 c
cm1690 rev. 2 | page 5 of 10 | www.onsemi.com electrical operating characteristics (see note1) symbol parameter conditions min typ max units l channel inductance 12 nh c total total channel capacitance at 2.5vdc reverse bias, 1mhz, 30mvac 25 33 40 pf c capacitance c1 at 2.5vdc reverse bias, 1mhz, 30mvac 16.5 pf v diode standoff voltage i diode = 10 a 6.0 v i leak diode leakage current (reverse bias) v diode = +3.3v 0.1 0.3 a v sig signal clamp voltage positive clamp negative clamp i load = 10ma i load = ?10ma; note 3 5.6 ?1.5 6.8 ?0.8 9.0 ?0.4 v v v esd in-system esd withstand voltage a) human body model, mil-std-883, method 3015 b) contact discharge per iec 61000-4-2 level 4 notes 2 and 4 30 15 kv kv r dyn dynamic resistance positive negative 2.3 0.9 f c roll-off frequency at -6db attenuation z source = 50 , z load = 50 330 mhz r insulation insulation resistance v diode =3.3v, note 4 10 ? r channel channel resistance 8 note 1: t a =25 c unless otherwise specified. note 2: esd applied to input and output pins with r espect to gnd, one at a time. note 3: clamping voltage is measured at the opposit e side of the emi filter to the esd pin (i.e. if es d is applied to pin a1 then clamping voltage is measured at pin c1). note 4: unused pins are left open.
cm1690 rev. 2 | page 6 of 10 | www.onsemi.com performance information typical diode capacitance vs. input voltage figure 1. filter capacitance vs. input voltage (normalized to capacitance at 2.5vdc and 25c) figure 2. typical performance curve
cm1690 rev. 2 | page 7 of 10 | www.onsemi.com mechanical details udfn-08 mechanical specifications dimensions for the cm1690 supplied in an 8-lead, 0. 4mm pitch udfn package are presented below. package dimensions package udfn jedec no. mo-229c * leads 8 millimeters inches dim. min nom max min nom max a 0.45 0.50 0.55 0.018 0.020 0.022 a1 0.00 0.02 0.05 0.000 0.001 0.002 a3 0.127 ref 0.005 ref b 0.15 0.20 0.25 0.006 0.008 0.010 d 1.60 1.70 1.80 0.063 0.067 0.071 d2 1.10 1.20 1.30 0.043 0.047 0.051 e 1.25 1.35 1.45 0.049 0.053 0.057 e2 0.30 0.40 0.50 0.012 0.016 0.020 e 0.40 bsc 0.016 bsc k 0.20 0.008 l 0.15 0.25 0.35 0.006 0.010 0.014 # per tape and reel 3000 controlling dimension: millimeters * this package is compliant with jedec standard mo-22 9c with the exception of the d, d2, e, e2, k and l dimensio ns as called out in the table above. dimensions for 8-lead, 0.4mm pitch udfn package
cm1690 rev. 2 | page 8 of 10 | www.onsemi.com mechanical details (cont?d) udfn-12 mechanical specifications dimensions for the cm1690 supplied in a 12-lead, 0. 4mm pitch udfn package are presented below. package dimensions package udfn jedec no. mo-229c * leads 12 millimeters inches dim. min nom max min nom max a 0.45 0.50 0.55 0.018 0.020 0.022 a1 0.00 0.02 0.05 0.000 0.001 0.002 a3 0.127 ref 0.005 ref b 0.15 0.20 0.25 0.006 0.008 0.010 d 2.40 2.50 2.60 0.094 0.098 0.102 d2 1.90 2.00 2.10 0.075 0.079 0.083 e 1.25 1.35 1.45 0.049 0.053 0.057 e2 0.30 0.40 0.50 0.012 0.016 0.020 e 0.40 bsc 0.016 bsc k 0.20 0.008 l 0.15 0.25 0.35 0.006 0.010 0.014 # per tape and reel 3000 controlling dimension: millimeters * this package is compliant with jedec standard mo-22 9c with the exception of the d, d2, e, e2, k and l dimensio ns as called out in the table above. dimensions for 12-lead, 0.4mm pitch udfn package
cm1690 rev. 2 | page 9 of 10 | www.onsemi.com mechanical details (cont?d) udfn-16 mechanical specifications dimensions for the cm1690 supplied in a 16-lead, 0. 4mm pitch udfn package are presented below. package dimensions package udfn jedec no. mo-229c * leads 16 millimeters inches dim. min nom max min nom max a 0.45 0.50 0.55 0.018 0.020 0.022 a1 0.00 0.02 0.05 0.000 0.001 0.002 a3 0.127 ref 0.005 ref b 0.15 0.20 0.25 0.006 0.008 0.010 d 3.20 3.30 3.40 0.126 0.130 0.134 d2 2.70 2.80 2.90 0.106 0.110 0.114 e 1.25 1.35 1.45 0.049 0.053 0.057 e2 0.30 0.40 0.50 0.012 0.016 0.020 e 0.40 bsc 0.016 bsc k 0.20 0.008 l 0.15 0.25 0.35 0.006 0.010 0.014 # per tape and reel 3000 controlling dimension: millimeters * this package is compliant with jedec standard mo-22 9c with the exception of the d, d2, e, e2, k and l dimensio ns as called out in the table above. dimensions for 16-lead, 0.4mm pitch udfn package
cm1690 rev. 2 | page 10 of 10 | www.onsemi.com on semiconductor and are registered trademarks of semiconductor componen ts industries, llc (scillc). scillc reserves the ri ght to make changes without further notice to any products herein. scillc makes no warranty, represe ntation or guarantee regarding the suitability of i ts products for any particular purpose, nor does sc illc assume any liability arising out of the application or use of any product or cir cuit, and specifically disclaims any and all liabil ity, including without limitation special, conseque ntial or incidental damages. ?typical? parameters which may be provided in scillc data she ets and/or specifications can and do vary in differ ent applications and actual performance may vary ov er time. all operating parameters, including ?typicals? must be validated for each customer application by customer's technic al experts. scillc does not convey any license und er its patent rights nor the rights of others. scillc products are not designed , intended, or authorized for use as components in systems intended for surgical implant into the body , or other applications intended to support or sustain life, or for any other applicati on in which the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unau thorized application, buyer shall indemnify and hol d scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and ex penses, and reasonable attorney fees arising out of , directly or indirectly, any claim of personal inj ury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the des ign or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applic able copyright laws and is not for resale in any ma nner. publication ordering information publication ordering information publication ordering information publication ordering information literature fulfillment literature fulfillment literature fulfillment literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone phone phone phone : 303-675-2175 or 800-344-3860 toll free usa/canada fax fax fax fax : 303-675-2176 or 800-344-3867 toll free usa/canada email email email email : orderlit@onsemi.com n. american technical support n. american technical support n. american technical support n. american technical support : 800-282-9855 toll free usa/canada europe, middle east and africa technical europe, middle east and africa technical europe, middle east and africa technical europe, middle east and africa technical support: support: support: support: phone: 421 33 790 2910 japan customer focus center japan customer focus center japan customer focus center japan customer focus center phone: 81-3-5773-3850 on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative
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